EMC (Epoxy Molding Compound)
环氧模塑料 / Epoxidformmasse / 에폭시 몰딩 컴파운드
A thermosetting material used in semiconductor packages, mainly composed of epoxy resin, curing agents, and fillers, which provides electrical insulation from external environments and protects the device against moisture and mechanical shock.
Semiconductor encapsulation materials, automotive electronic components, smartphones, PCs, home appliances
Manufacturing process
※This process is just one example, and the manufacturing methods vary by company.
To prevent gel formation caused by excessive temperature rise during kneading, the product temperature must be controlled. In addition, the generation of metal contamination adversely affects the performance of the encapsulation material.
The twin-screw continuous kneader "KRC Kneader" suppresses the formation of gel particles and enables the production of uniform and stable products, while also offering excellent durability and ease of maintenance, by the following mechanical characteristics.
Removal of kneading heat by cooling through the jacketed barrel
Metal contamination is minimized by the bearing structures installed at both ends of the paddle shaft.
Wetted parts are made of wear-resistant materials. And easy to replace.
& crushing
& Particle size
adjustment
Excessive generation of fine powder during grinding or granulating adversely affects moldability in downstream processes. In addition, metal contamination caused by wear can negatively impact the performance of the encapsulation material.
The "Roll Granulator" suppresses the generation of fines and effectively reduces metal contamination by the following mechanical characteristics.
The system can be configured as a multi-stage setup by combining multiple units.
The generation of fine particles is suppressed by stepwise adjustment of the roll groove pitch.
The rolls are made of wear-resistant materials, thereby minimizing metal contamination.
& forming
